Electronics Coatings

Products: 14 of 4
  • 3M™ High-Temperature Masking Liquid 2538, 1 kg
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    3M™ High-Temperature Masking Liquid 2538, 1 kg

    3M High-Temperature Masking Liquid EAS2538 is an olefin hybrid adhesive that is specially formulated to offer excellent high-temperature resistance and low slump during processing. This specially formulated hot melt removes cleanly from various electronic substrates by peeling even after 10 min @ 260°C (500°F). The non-silicone formulation reduces the potential for silicone contamination which can interfere with subsequent bonding or conformal coating processes. The high-temperature resistance adhesive also possesses excellent chemical resistance and can be considered for demanding chemical masking applications.
    • $1036.51
    • Case of 8 - $1036.51
  • 3M™ High-Temperature Masking Liquid 2538UV

    Clean removal;Excellent conformability upon dispensing;Fast process time;Good chemical resistance to conformal coatings, acids and bases ingression;Good wet out on various substrates such as FR4, metals and glass;High-temperature slump resistance;Silicone free;Stable dielectric properties;UV detectable
    • $1243.81
    • Case of 8 - $1243.81
  • 3M™ High-Temperature Masking Liquid 2538, 1 kg

    3M™ High-Temperature Masking Liquid 2538 is an olefin hybrid adhesive that is specially formulated to offer excellent high-temperature resistance and low slump during processing. This specially formulated hot melt removes cleanly from various electronic substrates by peeling even after 10 min @ 260°C (500°F). The non-silicone formulation reduces the potential for silicone contamination which can interfere with subsequent bonding or conformal coating processes. The high-temperature resistance adhesive also possesses excellent chemical resistance and can be considered for demanding chemical masking applications.
    • $169.00
    • Case of 1 - $169.00
  • 3M™ High-Temperature Masking Liquid 2538UV, 1 kg

    3M™ High-Temperature Masking Liquid 2538 is an olefin hybrid adhesive that is specially formulated to offer excellent high-temperature resistance and low slump during processing. This specially formulated hot melt removes cleanly from various electronic substrates by peeling even after 10 min @ 260°C (500°F). The non-silicone formulation reduces the potential for silicone contamination which can interfere with subsequent bonding or conformal coating processes. The high-temperature resistance adhesive also possesses excellent chemical resistance and can be considered for demanding chemical masking applications.
    • $202.80
    • Case of 1 - $202.80